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Earlier:
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Inspection, Mathematical models, Transformers, Solid modeling,
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Deep learning, Visualization, Photovoltaic cells, Neural networks,
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graph theory, image recognition,
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SMD position measurement by a Kohonen network compared with image
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CAIP95(606-611).
Springer DOI
9509
SMD: Surface Mounted Device.
BibRef
Darboux, M.[Michel],
Dinten, J.M.[Jean-Marc],
Development of an automated bond verification system for advanced
electronic packages,
CIAP95(737-742).
Springer DOI
9509
BibRef
Cook, B.D.,
Lee, S.Y.[Soo-Young],
Fast exposure simulation for large circuit patterns in electron beam
lithography,
ICIP95(I: 442-445).
IEEE DOI
9510
BibRef
Hiroi, T.,
Maeda, S.,
Kubota, H.,
Watanabe, K.,
Nakagawa, Y.,
Precise visual inspection for LSI wafer patterns using subpixel image
alignment,
WACV94(26-34).
IEEE Abstract.
0403
BibRef
Thibadeau, R.H.[Robert H.],
Printed Circuit Board inspection,
CMU-RI-TR-81-8, 1981, CMU Robotics Institute.
Survey, Inspection.
Inspection, PCB - Survey. Survey of various techniques - expand contract and see the different
areas, table lookup of patterns (difficult), spatial entropy, run
lengths (most are in certain range, others are errors), FFT
analysis, analysis of edge coding. The goal seems to be to try many
alternatives and use results to analyze defects.
BibRef
8100
Thibadeau, R.H.[Robert H.],
Friedman, M.[Mark], and
Seto, J.[John],
Automatic Inspection for Printed Wiring,
CMU-RI-TR-82-16, 1982, CMU Robotics Institute,
Presented at the Institute for Interconnecting and Package
Electronic Circuits, Fall Meeting, San Diego, CA, October 3, 1982.
Inspection, PCB. An outline of the considerations for a semi-automated PCB inspection
station that is being built at Westinghouse and the RI. He mentions
that there are 4 other systems that have been announced by other
companies for sale (Hughes, Itek, Automation Engineering, Elron).
BibRef
8210
Ninomiya, T.,
Yoshimura, K.,
Nomoto, M.,
Nakagawa, Y.,
Automatic Printed Circuit Pattern Inspection Using Connectivity
Preserving Image Reduction and Connectivity Comparison,
ICPR92(I:53-56).
IEEE DOI
BibRef
9200
Chehdi, K.,
Corazza, M.,
Automatic System of Quality Control of Hybrid Circuits by
Image Analysis,
ICPR92(I:433-436).
IEEE DOI
BibRef
9200
Khotanzad, A.,
Banerjee, H.,
Srinath, M.,
A vision system for inspection of ball bonds in integrated circuits,
WACV92(290-297).
IEEE DOI
0403
BibRef
Khalaj, B.H.,
Aghajan, H.K.,
Kailath, T.,
Automated direct patterned wafer inspection,
WACV92(266-273).
IEEE DOI
0403
BibRef
Dainis, III, G.A.,
Ward, M.O.,
Rule-Based Inspection of Leadframes,
CVPR88(580-585).
IEEE DOI
BibRef
8800
Chapter on Implementations and Applications, Databases, QBIC, Video Analysis, Hardware and Software, Inspection continues in
Inspection -- Solder Joints, Welding, Pipes .