19.6.3.2 Inspection -- Chips, Wafers, PCB, PWB, VLSI, IC, Disks, etc.

Chapter Contents (Back)
Real Time Vision. Application, Inspection. PCB Inspection. Wafer Inspection. Defect Detection.

Orbotech Ltd.,
2001
WWW Link. Vendor, Inspection. Industrial inspection systems for semiconductors.

ICOS,
2007
WWW Link. Vendor, Inspection. Industrial inspection systems for semiconductors.

Watkins, L.S.,
Inspection of IC Photomasks with Intensity Spatial Filters,
PIEEE(57), 1969, pp. 1634-1639. BibRef 6900

Axelrod, N.N.,
Intensity Spatial Filtering Applied to Defect Detection in Integrated Circuit Photomasks,
PIEEE(60), 1972, pp. 447-448. BibRef 7200

Bourdelais, R.J., Colangelo, D., McFadyen, R.J., and Elliott, J.F.,
Instrument for Automatically Inspecting Integrated Circuit Masks for Pinholes and Spots,
US_Patent3,795,452, March 5, 1974.
WWW Link. BibRef 7403

Harlow, C.A., Henderson, S.E., Rayfield, D.A., Johnson, R.J., and Dwyer, III, S.J.,
Automated Inspection of Electronic Assemblies,
Computer(8), No. 4, April 1975, pp. 36-45. BibRef 7504

Olsen, O.A.,
Visual Method of Locating Faults in Printed Circuit Boards,
US_Patent3,976,383, August 24, 1976.
WWW Link. BibRef 7608

Baxter, D.W., and Shipway, R.E.,
Defect Inspection of Objects Such as Electronic Circuits,
US_Patent4,056,716, November 1, 1977.
WWW Link. BibRef 7711

McVey, E.S., van Tol, A.,
An experimental printed circuit board drilling system automated by pattern recognition,
PR(11), No. 4, 1979, pp. 271-276.
WWW Link. 0309
BibRef

Hsieh, Y.Y., and Fu, K.S.,
An Automatic Visual Inspection System for Integrated Circuit Chips,
CGIP(14), No. 4, December 1980, pp. 293-343.
WWW Link. BibRef 8012

Jarvis, J.F.,
A Method for Automating the Visual Inspection of Printed Wiring Boards,
PAMI(2), No. 1, January 1980, pp. 77-83. Inspection, PWB. BibRef 8001

Goto, N., Kondo, T.,
An Automatic Inspection System for Printed Wiring Board Masks,
PR(12), No. 6, 1980, pp. 443-455.
WWW Link. BibRef 8000

Pau, L.F.,
Integrated Testing and Algorithms for Visual Inspection of Integrated Circuits,
PAMI(5), No. 6, November 1983, pp. 602-608. BibRef 8311
Earlier:
Semiconductio IC's: Integrated Testing and Algorithms for Visual Inspection,
ICPR80(238-240). BibRef

IC testing system.

Baird, M.L.,
SIGHT-I: A Computer Vision System for Automated IC Chip Manufacture,
SMC(8), No. 2, February 1978, pp. 133-139. BibRef 7802
Earlier:
An Application ov Computer Vision to Automatic IC Chip Manufacture,
ICPR76(3-7). BibRef

West, M.A., de Foster, S., Baldwin, E.C., Zeigler, R.A.,
Computer Controlled Optical Testing of High-Density Printed-Circuit Boards,
IBMRD(27), No. 1, 1983, pp. 50-58. BibRef 8300

Crabb, R.M.[Robert M.], de Foster, S.M.[Steven M.], Rittenhouse, N.E.[Norman E.], West, M.A.[Mark A.], Ziegler, R.A.[Richard A.],
System for measuring and detecting printed circuit wiring defects,
US_Patent4,650,333, March 17, 1987.
WWW Link. BibRef 8703

Wahl, F.[Friedrich], So, S.[Samuel], and Wong, K.[Kwan],
A Hybrid Optical-Digital Image Processing Method for Surface Inspection,
IBMRD(27), No. 4, July 1983, pp. 376-385. BibRef 8307

Rubat du Merac, C., Jutier, P., Laurent, J., Courtois, B.,
A New Domain for Image Analysis: VLSI Circuit Testing, with ROMULAD, Specialized in Parallel Image Processing,
PRL(1), 1983, pp. 347-357. BibRef 8300

Zeller, H., Doemens, G.,
Applications of Pattern Recognition in Semiconductor and Printer Board Production,
SP(5), 1983, pp. 399-412. BibRef 8300

Wilder, J.,
Machine Vision for Inspection of Keyboards,
SP(5), 1983, pp. 413-421. BibRef 8300

West, G.A.W.,
A System for the Automatic Visual Inspection of Bare-Printed Circuit Boards,
SMC(14), 1984, pp. 767-773. BibRef 8400

Nakashima, M.[Masato], Koezuka, T.[Tetsuo], Inagaki, T.[Takefumi],
Recognition method and apparatus,
US_Patent4,450,579, May 22, 1984
WWW Link. BibRef 8405

Mandeville, J.R.,
Novel Method for Analysis of Printed Circuit Images,
IBMRD(29), No. 1, January 1985, pp. 73-86. BibRef 8501

Bixler, J.P., Sanford, J.P.,
A Technique for Encoding Lines and Regions in Engineering Drawings,
PR(18), No. 5, 1985, pp. 367-377.
WWW Link. BibRef 8500

Yoda, H., Ohuchi, Y., Taniguchi, Y., and Ejiri, M.,
An Automatic Wafer Inspection System Using Pipelined Image Processing Techniques,
PAMI(10), No. 1, January 1988, pp. 4-16.
IEEE DOI BibRef 8801

Hara, Y., Doi, H., Karasaki, K., and Iida, T.,
A System for PCB Automated Inspection Using Fluorescent Light,
PAMI(10), No. 1, January 1988, pp. 69-78.
IEEE DOI BibRef 8801

Shu, D.B., Li, C.C., Mancuso, J.F., and Sun, Y.N.,
A Line Extraction Method for Automated SEM Inspection of VLSI Resist,
PAMI(10), No. 1, January 1988, pp. 117-120.
IEEE DOI BibRef 8801

Ando, M., Inagaki, T.,
Automatic Optical Inspection of Plated Through-Holes for Ultrahigh Density Printed Wiring Boards,
MVA(1), 1988, pp. 175-181. BibRef 8800

Dom, B.E., Brecher, V.H., Bonner, R., Batchelder, J.S., Jaffe, R.S.,
The P300: A System for Automatic Pattern Wafer Inspection,
MVA(1), 1988, pp. 205-221. BibRef 8800

Hara, Y., Akiyama, N., and Karasaki, K.,
Automatic Inspection System for Printed Circuit Boards,
PAMI(5), No. 6, November 1983, pp. 623-630. Vertical and diagonal lighting to make the metal pattern more obvious, then the inspection becomes easier. BibRef 8311

Hara, Y., Okamoto, K., Hamada, T., Akiyama, N., Nakagawa, K., Torisawa, S., and Nakashima, S.,
Automatic Visual Inspection of LSI Photomasks,
ICPR80(273-279). BibRef 8000

Sanz, J.L.C., and Petkovic, D.,
Machine Vision Algorithms for Automated Inspection of Thin-Film Disk Heads,
PAMI(10), No. 6, November 1988, pp. 830-848.
IEEE DOI Inspection, Disk Heads. Real system to inspect disk head assemblies. Not much new from the vision point of view, except that it works. BibRef 8811

Sanz, J.L.C., Dinstein, I., and Petkovic, D.,
Computing Multi-Colored Polygonal Masks in Pipeline Architectures and Its Application to Automated Visual Inspection,
CACM(30), No. 4, April 1987, pp. 318-329. The different templates (colors of polygons) are used to find features in the image which can then be closely inspected. BibRef 8704

Petkovic, D., Hinkle, E.B.,
A Rule-Based System for Verifying Engineering Specifications in Industrial Visual Inspection Applications,
PAMI(9), No. 2, March 1987, pp. 306-311. BibRef 8703

Dom, B., Steele, D., Petkovic, D., Kuhlmann, L.,
Algorithms for automatic disk head/slider inspection,
ICPR94(A:295-300).
IEEE DOI 9410
BibRef

Petkovic, D., Sanz, J.L.C., Mohiuddin, K.M.A., Hinkle, E.B., Flickner, M.D., Cox, C., Wong, K.,
An Experimental System for Disk Head Inspection,
ICPR86(9-13). BibRef 8600

Sprague, A.P., Donahue, M.J., and Rokhlin, S.I.,
A Method for Automatic Inspection of Printed Circuit Boards,
CVGIP(54), No. 3, November 1991, pp. 401-415.
WWW Link. Find features in the pattern and match to features in the reference graph pattern. BibRef 9111

Wojcik, Z.M.[Zbigniew M.],
An Approach to the Recognition of Contours and Line-Shaped Objects,
CVGIP(25), No. 2, February 1984, pp. 184-204.
WWW Link. Recognize Line Models. The use of some line analysis techniques that extend to PCB inspection. BibRef 8402

Ellison, T.P.[Timothy P.], Taylor, C.J.[Christopher J.],
Calculating the surface topography of integrated circuit wafers from SEM images,
IVC(9), No. 1, February 1991, pp. 3-9.
WWW Link. 0401
BibRef
Earlier: BMVC90(xx-yy).
PDF File. 9009
BibRef

Yu, K.K.[Kenneth K.], Berglund, C.N.[C. Neil],
Automated system for extracting design and layout information from an integrated circuit,
US_Patent5,086,477, Feb 4, 1992
WWW Link. BibRef 9202

Lebeau, C.J.[Christopher J.],
Method for automatic semiconductor wafer inspection,
US_Patent5,129,009, Jul 7, 1992
WWW Link. BibRef 9207

Bushroe, M.W.[Michael W.],
Solder joint locator,
US_Patent5,164,994, Nov 17, 1992
WWW Link. BibRef 9211

Dom, B.E., Brecher, V.,
Recent Advances in the Automatic Inspection of Integrated-Circuits for Pattern Defects,
MVA(8), No. 1, 1995, pp. 5-19. BibRef 9500

Khalaj, B.H., Aghajan, H.K., Kailath, T.,
Patterned Wafer Inspection By High-Resolution Spectral Estimation Techniques,
MVA(7), No. 3, 1994, pp. 178-185. BibRef 9400

Teoh, E.K., Mital, D.P.,
A Transputer-Based Automated Visual Inspection System for Electronic Devices and PCBs,
OptLas(22), No. 3, 1995, pp. 161-180. BibRef 9500

Moganti, M., Ercal, F., Dagli, C.H., Tsunekawa, S.,
Automatic PCB Inspection Algorithms: A Survey,
CVIU(63), No. 2, March 1996, pp. 287-313.
DOI Link Survey, Inspection. BibRef 9603

Rao, A.R.,
Future-Directions in Industrial Machine Vision: A Case-Study of Semiconductor Manufacturing Applications,
IVC(14), No. 1, February 1996, pp. 3-19.
WWW Link. 9608
BibRef

Yuan, M.C., Li, J.G.,
A Production System for LSI Chip Anatomizing,
PRL(5), 1987, pp. 227-232. BibRef 8700

Blanz, W.E., Sanz, J.L.C., Hinkle, E.B.,
Image Analysis Methods for Solder-Ball Inspection in Integrated Circuit Manufacturing,
RA(4), 1988, pp. 129-139. BibRef 8800

Chou, P.B., Rao, A.R., Sturzenbecker, M.C., Wu, F.Y., Brecher, V.H.,
Automatic Defect Classification for Semiconductor Manufacturing,
MVA(9), No. 4, 1997, pp. 201-214.
HTML Version. Visual Inspection. BibRef 9700

An, J.N., Cho, Y.B., Gweon, D.G.,
A New Method for Image Separation of Overlapped Images from a Two-Layered Printed Circuit Board (PCB),
IVC(15), No. 11, November 1997, pp. 861-866.
WWW Link. 9712
BibRef

Kim, S.W., Lee, S.Y., Yoon, D.S.,
Rapid Pattern Inspection of Shadow Masks by Machine Vision Integrated with Fourier Optics,
OptEng(36), No. 12, December 1997, pp. 3309-3311. 9801
BibRef

Zhou, H., Kassim, A.A., Ranganath, S.,
A Fast Algorithm for Detecting Die Extrusion Defects in IC Packages,
MVA(11), No. 1, 1998, pp. 37-41.
HTML Version. 9808
BibRef

Kassim, A.A., Zhou, H., Ranganath, S.,
Automatic IC orientation checks,
MVA(12), No. 3, 2000, pp. 107-112.
HTML Version. 0010
BibRef

Nichani, S.[Sanjay], Scola, J.[Joseph],
Semiconductor device image inspection utilizing image subtraction and threshold imaging,
US_Patent5,949,901, Sep 7, 1999
WWW Link. BibRef 9909

Ichikawa, I.[Iwao],
Laser beam inspection apparatus,
US_Patent6,618,135, Sep 9, 2003
WWW Link. BibRef 0309

Chung, H.K., Park, R.H.,
2-Stage High-Precision Visual Inspection of Surface Mount Devices,
JEI(6), No. 4, October 1997, pp. 517-524. 9807
BibRef

Moganti, M.[Madhav], Ercal, F.[Fikret],
A Subpattern Level Inspection System for Printed Circuit Boards,
CVIU(70), No. 1, April 1998, pp. 51-62.
DOI Link BibRef 9804

Moganti, M.[Madhav], Ercal, F.[Fikret],
Segmentation of Printed Circuit Board Images into Basic Patterns,
CVIU(70), No. 1, April 1998, pp. 74-86.
DOI Link BibRef 9804

Fadzil, A.[Ahmad], Weng, C.J.[Chu Jenn],
LED Cosmetic Flaw Inspection System,
PAA(1), No. 1, 1998, pp. 62-70. BibRef 9800

Rodriguez, A.A., Mandeville, J.R.,
Image registration for automated inspection of printed circuit patterns using CAD reference data,
MVA(6), No. 4, 1993, pp. 233-242. BibRef 9300

Rajeswari, M., Rodd, M.G.,
Real-time Analysis of an IC Wire-bonding Inspection System,
RealTimeImg(5), No. 6, December 1999, pp. 409-421. 0003
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Beaty, E.M.[Elwin M.], Mork, D.P.[David P.],
Three dimensional inspection system,
US_Patent6,055,054, Apr 25, 2000
WWW Link. BibRef 0004

Xie, P.[Pin], Guan, S.U.[Sheng-Uei],
A golden-template self-generating method for patterned wafer inspection,
MVA(12), No. 3, 2000, pp. 149-156.
HTML Version. 0010
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Guan, S.U.[Sheng-Uei], Xie, P.[Pin], Li, H.[Hong],
A golden-block-based self-refining scheme for repetitive patterned wafer inspections,
MVA(13), No. 5-6, 2003, pp. 314-321.
HTML Version. 0304
BibRef

Guan, S.U.[Sheng-Uei], Xie, P.[Pin],
A golden block self-generating scheme for continuous patterned wafer inspections,
CIAP99(436-441).
IEEE DOI 9909
BibRef

Zoroofi, R.A.[Reza Aghaeizadeh], Taketani, H.[Hisashi], Tamura, S.[Shinichi], Sato, Y.[Yoshinobu], Sekiya, K.[Kazuma],
Automated inspection of IC wafer contamination,
PR(34), No. 6, June 2001, pp. 1307-1317.
WWW Link. 0103
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van Dop, E.R.[Erik R.], Regtien, P.P.L.[Paul P.L.],
Multi-sensor recognition of electronic components,
MVA(12), No. 5, 2001, pp. 213-222.
HTML Version. 0103
BibRef

Ye, Q.Z., Ong, S.H., Han, X.,
A stereo vision system for the inspection of IC bonding wires,
IJIST(11), No. 4, 2001, pp. 254-262.
WWW Link. 0105
BibRef

Bréhélin, L.[Laurend], Gascuel, O.[Olivier], Caraux, G.[Gilles],
Hidden Markov Models with Patterns to Learn Boolean Vector Sequences and Application to the Built-In Self-Test for Integrated Circuits,
PAMI(23), No. 9, September 2001, pp. 997-1008.
IEEE DOI 0110
Variation of HMM. BibRef

Qu, G.Y.[Gong-Yuan], Wood, S.L.[Sally L.], Teh, C.[Cho],
Wafer Defect Detection Using Directional Morphological Gradient Techniques,
JASP(2002), No. 7, July 2002, pp. 686-703. 0208
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Tobin, K.W.[Kenneth W.], Karnowski, T.P.[Thomas P.], Arrowood, L.F.[Lloyd F.], Ferrell, R.K.[Regina K.], Goddard, J.S.[James S.], Lakhani, F.[Fred],
Content-Based Image Retrieval for Semiconductor Process Characterization,
JASP(2002), No. 7, July 2002, pp. 704-713. 0208
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Tsai, D.M., Chou, C.C.,
A fast focus measure for video display inspection,
MVA(14), No. 3, July 2003, pp. 192-196.
WWW Link. 0308
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Roh, Y.J.[Young Jun], Park, W.S.[Won Shik], Cho, H.S.[Hyung-Suck],
Correcting image distortion in the X-ray digital tomosynthesis system for PCB solder joint inspection,
IVC(21), No. 12, November 2003, pp. 1063-1075.
WWW Link. 0310
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Baidyk, T., Kussul, E., Makeyev, O., Caballero, A., Ruiz, L., Carrera, G., Velasco, G.,
Flat image recognition in the process of microdevice assembly,
PRL(25), No. 1, January 2004, pp. 107-118.
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Toledo, G.K.[Gengis K.], Kussul, E.[Ernst], Baidyk, T.[Tatiana],
Neural classifier for micro work piece recognition,
IVC(24), No. 8, August 2006, pp. 827-836.
WWW Link. 0608
Neural network; Object recognition; Position recognition; Microassembly BibRef

Toledo, G.K.[Gengis K.], Kussul, E.[Ernst], Baidyk, T.[Tatiana],
Work piece recognition based on the permutation neural classifier technique,
MVA(22), No. 3, May 2011, pp. 495-504.
WWW Link. 1104
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Fang, T.[Tong], Jafari, M.A.[Mohsen A.], Danforth, S.C.[Stephen C.], Safari, A.[Ahmad],
Signature analysis and defect detection in layered manufacturing of ceramic sensors and actuators,
MVA(15), No. 2, December 2003, pp. 63-75.
Springer DOI 0401
BibRef

Zervakis, M.E., Goumas, S.K., Rovithakis, G.A.,
A Bayesian Framework for Multilead SMD Post-Placement Quality Inspection,
SMC-B(34), No. 1, February 2004, pp. 440-453.
IEEE Abstract. 0403
BibRef
Earlier: A2, A3, A1:
A Bayesian image analysis framework for post-placement quality inspection of components,
ICIP02(II: 549-552).
IEEE DOI 0210
BibRef

Kubota, T.[Toshiro], Talekar, P.[Parag], Ma, X.Y.[Xian-Yun], Sudarshan, T.S.[Tangali S.],
A nondestructive automated defect detection system for silicon carbide wafers,
MVA(16), No. 3, May 2005, pp. 170-176.
Springer DOI 0505
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di Palma, F., de Nicolao, G., Miraglia, G., Pasquinetti, E., Piccinini, F.,
Unsupervised spatial pattern classification of electrical-wafer-sorting maps in semiconductor manufacturing,
PRL(26), No. 12, September 2005, pp. 1857-1865.
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Shankar, N.G., Zhong, Z.W.,
Improved segmentation of semiconductor defects using area sieves,
MVA(17), No. 1, April 2006, pp. 1-7.
Springer DOI 0604
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Lin, H.D.[Hong-Dar],
Tiny surface defect inspection of electronic passive components using discrete cosine transform decomposition and cumulative sum techniques,
IVC(26), No. 5, May 2008, pp. 603-621.
WWW Link. 0803
Tiny surface defect inspection; Electronic passive components; Discrete cosine transform decomposition; Cumulative sum technique BibRef

Watanabe, T.[Takashi], Kusano, A.[Akira], Fujiwara, T.[Takayuki], Koshimizu, H.[Hiroyasu],
3D Precise Inspection of Terminal Lead for Electronic Devices by Single Camera Stereo Vision,
IEICE(E91-D), No. 7, July 2008, pp. 1885-1892.
DOI Link 0807
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Kusano, A.[Akira], Watanabe, T.[Takashi], Funahashi, T.[Takuma], Koshimizu, H.[Hiroyasu],
Defect detection of terminal lead by single stereo vision,
FCV13(237-241).
IEEE DOI 1304
BibRef

Last, M.[Mark], Kandel, A.[Abraham],
Perception-based Analysis Of Engineering Experiments In The Semiconductor Industry,
IJIG(2), No. 1, January 2002, pp. 107-126. 0201
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Ng, A.N.Y.[Ada N.Y.], Lam, E.Y.[Edmund Y.], Chung, R.[Ronald], Fung, K.S.M.[Kenneth S.M.], Leung, W.H.,
Reference-free Machine Vision Inspection Of Semiconductor Die Images,
IJIG(9), No. 1, January 2009, pp. 133-152. 0903
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Chen, C.S.[Chin-Sheng], Yeh, C.W.[Chun-Wei], Yin, P.Y.[Peng-Yeng],
A novel Fourier descriptor based image alignment algorithm for automatic optical inspection,
JVCIR(20), No. 3, April 2009, pp. 178-189.
Elsevier DOI 0903
Fourier descriptor; Image alignment; Automatic optical inspection; Component detection; Contour tracing; Run length encoding; Blobs tables; Phase-shifted technique BibRef

Chang, C.Y., Li, C.H., Lin, S.Y., Jeng, M.,
Application of Two Hopfield Neural Networks for Automatic Four-Element LED Inspection,
SMC-C(39), No. 3, May 2009, pp. 352-365.
IEEE DOI 0904
BibRef

Tsai, D.M.[Du-Ming], Chang, C.C.[Chih-Chieh], Chao, S.M.[Shin-Min],
Micro-crack inspection in heterogeneously textured solar wafers using anisotropic diffusion,
IVC(28), No. 3, March 2010, pp. 491-501.
Elsevier DOI 1001
Defect detection; Heterogeneous texture; Anisotropic diffusion; Micro-crack; Solar wafer BibRef

Zontak, M.[Maria], Cohen, I.[Israel],
Defect detection in patterned wafers using anisotropic kernels,
MVA(21), No. 2, February 2010, pp. xx-yy.
Springer DOI 1002
BibRef

Sun, T.H.[Te-Hsiu], Tseng, C.C.[Chun-Chieh], Chen, M.S.[Min-Sheng],
Electric contacts inspection using machine vision,
IVC(28), No. 6, June 2010, pp. 890-901.
Elsevier DOI 1003
Machine vision; Surface defects; Electric contact; Computer vision; Quality control BibRef

Fan, S.K.S.[Shu-Kai S.], Chuang, Y.C.A.[Yu-Chi-Ang],
Automatic detection of Mura defect in TFT-LCD based on regression diagnostics,
PRL(31), No. 15, 1 November 2010, pp. 2397-2404.
Elsevier DOI 1003
TFT-LCD manufacturing; Mura defect detection; Regression diagnostics; PRESS residuals BibRef

Zhang, J.[Jun], Kim, Y.[Yongsik], Yang, S.H.[Seung-Hune], Milster, T.D.[Tom D.],
Illumination artifacts in hyper-NA vector imaging,
JOSA-A(27), No. 10, October 2010, pp. 2272-2284.
WWW Link. 1011
In microscopic system for photomask, wafer analysis. BibRef

He, X.F.[Xing-Fei], and Fang, F.[Frank],
Flat-Panel Color Filter Inspection,
VisSys(16), No. 5, May 2011, pp. xx-yy.
HTML Version. 1107
Inspection of flat-panel displays with line-scan cameras BibRef

Benedek, C.[Csaba],
Detection of soldering defects in Printed Circuit Boards with Hierarchical Marked Point Processes,
PRL(32), No. 13, 1 October 2011, pp. 1535-1543.
Elsevier DOI 1109
Marked Point Process; PCB; Scooping BibRef

Benedek, C.[Csaba],
A Two-Layer Marked Point Process Framework for Multilevel Object Population Analysis,
ICIAR13(160-169).
Springer DOI 1307
BibRef

Peng, Y.[Yao], Zhang, J.[Jinyu], Wang, Y.[Yan], Yu, Z.P.[Zhi-Ping],
Gradient-Based Source and Mask Optimization in Optical Lithography,
IP(20), No. 10, October 2011, pp. 2856-2864.
IEEE DOI 1110
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Long, T.[Ting], Wang, H.[Houjun], Long, B.[Bing],
Test generation algorithm for analog systems based on support vector machine,
SIViP(5), No. 4, November 2011, pp. 527-533.
WWW Link. 1111
Circuit testing. BibRef

Ibrahim, A.[Abdelhameed], Tominaga, S.[Shoji], Horiuchi, T.[Takahiko],
Invariant representation for spectral reflectance images and its application,
JIVP(2011), No. 1 2011, pp. xx-yy.
DOI Link 1203
BibRef
Earlier:
Spectral Invariant Representation for Spectral Reflectance Image,
ICPR10(2776-2779).
IEEE DOI 1008
BibRef
Earlier:
Material Classification for Printed Circuit Boards by Spectral Imaging System,
CCIW09(216-225).
Springer DOI 0903
BibRef

Horiuchi, T.[Takahiko], Ibrahim, A.[Abdelhameed], Kadoi, H.[Hideki], Tominaga, S.[Shoji],
An Effective Method for Illumination-Invariant Representation of Color Images,
Color12(II: 401-410).
Springer DOI 1210
BibRef
Earlier: A2, A1, A4, Only:
Illumination-invariant representation for natural color images and its application,
Southwest12(157-160).
IEEE DOI 1205
BibRef

Tominaga, S., Okamoto, S.,
Reflectance-based material classification for printed circuit boards,
CIAP03(238-243).
IEEE DOI 0310
BibRef

Horiuchi, T.[Takahiko], Suzuki, Y.[Yuhei], Tominaga, S.[Shoji],
Material Classification for Printed Circuit Boards by Kernel Fisher Discriminant Analysis,
CCIW11(152-164).
Springer DOI 1104
BibRef

Choy, S.K.[Siu Kai], Jia, N.N.[Ning-Ning], Tong, C.S.[Chong Sze], Tang, M.L.[Man Lai], Lam, E.Y.[Edmund Y.],
A Robust Computational Algorithm for Inverse Photomask Synthesis in Optical Projection Lithography,
SIIMS(5), No. 1 2012, pp. 625-651.
DOI Link 1205
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Jia, N.N.[Ning-Ning], Lam, E.Y.[Edmund Y.],
Stochastic gradient descent for robust inverse photomask synthesis in optical lithography,
ICIP10(4173-4176).
IEEE DOI 1009
BibRef

Yu, J.C.[Jue-Chin], Yu, P.[Peichen], Chao, H.Y.[Hsueh-Yung],
Library-Based Illumination Synthesis for Critical CMOS Patterning,
IP(22), No. 7, 2013, pp. 2811-2821.
IEEE DOI design automation; illumination source 1307
BibRef

Xu, S., Cheng, Z., Gao, Y., Pan, Q.,
Visual wafer dies counting using geometrical characteristics,
IET-IPR(8), No. 5, May 2014, pp. 280-288.
DOI Link 1407
BibRef

Duan, G.F.[Gui-Fang], Wang, H.C.[Hong-Cui], Liu, Z.Y.[Zhen-Yu], Tan, J.R.[Jian-Rong], Chen, Y.W.[Yen-Wei],
Automatic optical phase identification of micro-drill bits based on improved ASM and bag of shape segment in PCB production,
MVA(25), No. 6, 2014, pp. 1411-1422.
Springer DOI 1408
BibRef

Leibovici, M.C.R.[Matthieu C. R.], Gaylord, T.K.[Thomas K.],
Custom-modified three-dimensional periodic microstructures by pattern-integrated interference lithography,
JOSA-A(31), No. 7, July 2014, pp. 1515-1519.
DOI Link 1407
Microlithography BibRef

Estellers, V., Thiran, J.P., Gabrani, M.,
Surface Reconstruction From Microscopic Images in Optical Lithography,
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Chapter on Implementations and Applications, Databases, QBIC, Video Analysis, Hardware and Software, Inspection continues in
Inspection -- Solder Joints, Welding, Pipes .


Last update:Mar 13, 2017 at 16:25:24