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Vertical and diagonal lighting to make the metal
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IEEE DOI may work or IEEE-CS DOI may work.
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WWW Version. Find features in the pattern and match to features in the reference
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CIAP99(436-441).
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0310
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WWW Version.
0608Neural network; Object recognition; Position recognition; Microassembly
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IEEE Abstract. IEEE Top Reference.
0403
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ICIP02(II: 549-552).
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WWW Version.
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de Nicolao, G.,
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Pasquinetti, E.,
Piccinini, F.,
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PRL(26), No. 12, September 2005, pp. 1857-1865.
WWW Version.
0508
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Improved segmentation of semiconductor defects using area sieves,
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Tiny surface defect inspection of electronic passive components using
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WWW Version.
0803Tiny surface defect inspection; Electronic passive components;
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Fast Multi-template Matching Using a Particle Swarm Optimization
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Computer-Aided Vision System for MURA-Type Defect Inspection in Liquid
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PSIVT06(442-452).
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Ushida, A.[Akio],
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IWICPAS06(195-204).
WWW Version.
0608Analysis of circuits.
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Bourgeata, P.,
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Classifier Vote and Gabor Filter Banks for Wafer Segmentation,
ICIP05(I: 369-372).
IEEE DOI may work or IEEE-CS DOI may work.
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Ho, W.K.[Weng Khuen],
Tay, A.,
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ICARCV04(I: 485-490).
IEEE DOI may work or IEEE-CS DOI may work.
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El Doker, T.A.,
King, J.,
Scott, D.R.,
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IEEE Abstract. IEEE Top Reference.
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Reflectance-based material classification for printed circuit boards,
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IEEE Abstract. IEEE Top Reference.
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Pyun, J.Y.[Jae-Young],
Kim, N.H.[Nam-Hyeong],
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Ko, S.J.[Sung-Jea],
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DAGM03(458-465).
HTML Version.
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Hiroi, T.,
Shishido, C.[Chie],
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Pattern alignment method based on consistency among local registration
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WACV02(257-263).
IEEE Abstract. IEEE Top Reference.
0303
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Shimoda, A.,
Iwata, H.,
Shibata, Y.,
Ikeda, H.,
Thin Film Magnetic Head Wafer Inspection Technique Using
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MVA98(xx-yy).
BibRef
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Chang, M.C.,
Chen, H.Y.,
Fuh, C.S.,
Fast Search Algorithms for IC Printed Mark Quality Inspection,
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Marino, P.,
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Feature Extraction for Electronic Equipment Manufacturing,
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Tobin, K.W.,
Directional dilation for the connection of piece-wise objects:
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ICIP96(III: 9-12).
IEEE DOI may work or IEEE-CS DOI may work.
9610
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Lu, Y.[Yi],
Tisler, A.,
Machine Vision Inspection of VF Display Boards,
ICPR96(III: 839-843).
IEEE DOI may work or IEEE-CS DOI may work.
9608(Univ. of Michigan, USA)
BibRef
Doi, H.[Hideaki],
Suzuki, Y.[Yoko],
Hara, Y.[Yasuhiko],
Iida, T.[Tadashi],
Fujishita, Y.[Yasuhiro],
Karasaki, K.[Koichi],
Real-Time X-Ray Inspection of 3D Defects in Circuit Board Patterns,
ICCV95(575-582).
IEEE DOI may work or IEEE-CS DOI may work.
WWW Version.
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9500
Duin, R.P.W.[Robert P. W.],
Hoek, E.T.G.[Edwin T. G.],
SMD position measurement by a Kohonen network compared with image
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CAIP95(606-611).
WWW Version.
9509SMD: Surface Mounted Device.
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Darboux, M.[Michel],
Dinten, J.M.[Jean-Marc],
Development of an automated bond verification system for advanced
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CIAP95(737-742).
WWW Version.
9509
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Cook, B.D.,
Lee, S.Y.[Soo-Young],
Fast exposure simulation for large circuit patterns in electron beam
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ICIP95(I: 442-445).
IEEE DOI may work or IEEE-CS DOI may work.
9510
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Hiroi, T.,
Maeda, S.,
Kubota, H.,
Watanabe, K.,
Nakagawa, Y.,
Precise visual inspection for LSI wafer patterns using subpixel image
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WACV94(26-34).
IEEE Abstract. IEEE Top Reference.
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Thibadeau, R.H.[Robert H.],
Printed Circuit Board inspection,
CMU-RI-TR-81-8, 1981, CMU Robotics Institute.
Survey, Inspection.
Inspection, PCB - Survey. Survey of various techniques - expand contract and see the different
areas, table lookup of patterns (difficult), spatial entropy, run
lengths (most are in certain range, others are errors), FFT
analysis, analysis of edge coding. The goal seems to be to try many
alternatives and use results to analyze defects.
BibRef
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Thibadeau, R.H.[Robert H.],
Friedman, M.[Mark], and
Seto, J.[John],
Automatic Inspection for Printed Wiring,
CMU-RI-TR-82-16, 1982, CMU Robotics Institute,
Presented at the Institute for Interconnecting and Package
Electronic Circuits, Fall Meeting, San Diego, CA, October 3, 1982.
Inspection, PCB. An outline of the considerations for a semi-automated PCB inspection
station that is being built at Westinghouse and the RI. He mentions
that there are 4 other systems that have been announced by other
companies for sale (Hughes, Itek, Automation Engineering, Elron).
BibRef
8210
Ninomiya, T.,
Yoshimura, K.,
Nomoto, M.,
Nakagawa, Y.,
Automatic Printed Circuit Pattern Inspection Using Connectivity
Preserving Image Reduction and Connectivity Comparison,
ICPR92(I:53-56).
IEEE DOI may work or IEEE-CS DOI may work.
BibRef
9200
Chehdi, K.,
Corazza, M.,
Automatic System of Quality Control of Hybrid Circuits by
Image Analysis,
ICPR92(I:433-436).
IEEE DOI may work or IEEE-CS DOI may work.
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Khotanzad, A.,
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Srinath, M.,
A vision system for inspection of ball bonds in integrated circuits,
WACV92(290-297).
IEEE Abstract. IEEE Top Reference.
0403
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Khalaj, B.H.,
Aghajan, H.K.,
Kailath, T.,
Automated direct patterned wafer inspection,
WACV92(266-273).
IEEE Abstract. IEEE Top Reference.
0403
BibRef
Dainis, III, G.A.,
Ward, M.O.,
Rule-Based Inspection of Leadframes,
CVPR88(580-585).
IEEE Abstract. IEEE Top Reference.
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8800
Chapter on Implementations and Applications, Databases, QBIC, Video Analysis, Hardware and Software, Inspection continues in
Inspection -- Solder Joints, Welding, Pipes .